molding compound是什么意思_molding compound怎么读_molding compound的音标、翻译、近义词

1、

the history of the development and current situation of molding compound and its technical requirements for o-cresol formaldehyde epoxy resin was briefly introduced.

简单介绍了国内外环氧塑封料行业的发展历史和目前的状况以及环氧塑封料对邻甲酚醛环氧树脂的质量指标要求。

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2、

research on thickening process of low pressure sheet molding compound

低压片状模塑料增稠工艺研究

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3、

the matrix formulation and technical properties and processing technology of the low pressure molding compound were studied in this paper.

本文探讨了低压模塑料的配方、性能及加工工艺。

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4、

a new thickening system of low pressure sheet molding compound

新型低压片状模塑料增稠方法的研究

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5、

Thermal Conductive Performance and Thermal Simulation of High Thermal Conductive Epoxy Molding Compound Thermal Conductivity of the Carbon Nanotube/ Silicone Grease Composite

内嵌金属导热通道环氧模塑料导热性能与模拟碳纳米管/导热硅脂复合材料的导热性能

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6、

The optimization design was done for top module; increasing the chip thickness and coefficient of thermal expansion of epoxy molding compound and reducing the thickness of substrate were helpful to improve the thermal reliability under certain conditions.

针对顶部模块进行了优化设计，在一定条件下，增加芯片厚度和塑封料热膨胀系数、减小基板厚度有利于提高热可靠性。

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7、

the factory uses compression molding compound to make parts.

这家工厂使用压缩成型料来制造零件。

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8、

Effects of low profile additive on up matrix molding compound

低收缩添加剂对不饱和聚酯模塑料的影响

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9、

preparation of organic-fiber reinforced heat resistant phenolic molding compound

有机纤维增强的耐热型酚醛模塑料的研制

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10、

This paper introduces a high-temperature resistant and low shrinkage unsaturated polyester molding compound used for a novel reflector of automobile lamp.

研究了一种满足新型汽车车灯反射器的使用要求的低收缩率的耐高温不饱和聚酯模塑料。

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11、

after moisture absorption, substrate as well as most epoxy molding compound and bottom die attachment had reached saturated humidity in the top module. for bottom module, the epoxy molding compound, die attachment and substrate all reached saturated humidity.

吸湿后，顶部模块中的基板、大部分塑封料以及下层芯片粘接剂已达饱和湿度，底部模块的塑封料、芯片粘接剂和基板均达到饱和湿度。

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12、

the method of polypyrrole ( ppy) films being synthesized on the surface of insulating epoxy molding compound ( emc) electronic packaging materials and the shielding effectiveness of ppy film were studied.

研究了将导电聚吡咯（PPy）薄膜制备在绝缘环氧模塑料（EMC）电子封装材料表面的方法，及导电PPy薄膜的电磁屏蔽效能。

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13、

Study on the curing reaction kinetics of epoxy electrician molding compound

环氧电工塑料的固化反应动力学研究

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14、

epoxy molding compound ( emc) is a kind of electronic material applied in the package of semiconductor apparatus and ic chip.

环氧塑封料（Epoxy Molding Compound）是一种半导体封装用电子材料，主要应用于半导体器件和集成电路芯片的封装。

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15、

this factory produces epoxy molding compound for semiconductor encapsulation.

这家工厂生产用于半导体封装的环氧模塑料。

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16、

The results show that the mixture of B 2O 3 and ZnO are the proper thickening agent of phenolic sheet molding compound and the suitable thickening effect can be achieved.

结果表明，对于酚醛片状模塑料，B2O3和ZnO的混合体系是较好的增稠剂；

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17、

The Thermo-Mechanical Stress Analysis of Epoxy Molding Compound in PBGA

PBGA中环氧模塑封装材料的热力学应力分析

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18、

xylene resin modified phenolic molding compound

二甲苯树脂改性酚醛压塑粉

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19、

Bulk Molding Compound is specifically formulated for injection molding of automotive headlamp reflector applications.

玻璃纤维增强团状模塑料,是为汽车车灯设计的特殊配方.

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20、

the engineer used smc sheet molding compound to make a car part.

工程师用片状模塑料制造了一个汽车零件。

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21、

tension and fatigue tests on a widely used packaging epoxy molding compound ( emc) were performed under room and high temperatures.

对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。

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22、

the engineer tested the xylene resin modified phenolic molding compound.

工程师测试了这种二甲苯树脂改性酚醛模塑料。

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23、

Bulk Molding Compound with moderate strength material specifically formulated for microwave oven performance.

玻璃纤维增强团状模塑料,中等强度,主要用于微波炉产品.

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24、

the engineer used silicone molding compound to make a prototype.

工程师用硅胶成型化合物制作了一个原型。

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25、

In order to determine reasonable processing parameters, heating of thermosetting molding compound in the mold and that of heat transfer after curing temperature are analyzed.

本文就模压料在模具中加热过程和达到固化温度以后的传热过程进行定量分析，以确定合理的工艺控制参数。

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26、

nylon modified phenolic molding compound

尼龙改性酚醛压塑粉

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